MEASUREMENT OF MASS ATTENUATION COEFFICIENTS FOR CORN STARCH BONDED Rhizophora spp. PARTICLEBOARDS AT 16.59 -25.26 keV PHOTONS USING X-RAY FLUORESCENCE CONFIGURATION
The particleboards were fabricated using Rhizophora spp. wood particles with particles size less than 74 μm. The corn starch was used as a bio-adhesive in the fabrication of Rhizophora spp. particleboards. The corn starch bonded particleboards were fabricated at 5% and 10% corn starch based on dry mass of Rhizophora spp. wood particles. The measurement of mass attenuation coefficients of the particleboards were made at low and intermediate photon energies. The mass attenuation coefficient at low photon energy was measured using X-ray fluorescent (XRF) configuration based on attenuation of Kα1 X-ray energies between 16.59 and 25.26 keV given by niobium, molybdenum, palladium and tin metal plates. The calculated mass attenuation coefficients of samples were compared to the theoretical values mass attenuation coefficients of water calculated using the photon cross-section database (XCOM). The results showed that mass attenuation coefficients of 10% corn starch added Rhizophora spp. particleboards were in good agreement of water within 7.96 and 4.94% for 5% and 10% corn starch Rhizophora spp. Particleboards, respectively compared to 14.57 and 16.16% in binderless Rhizophora spp. particleboards and raw Rhizophora spp. wood, respectively.